Electroless Nickel Immersion Gold Process (ENIG) has good coating thickness uniformity because it uses its automatic catalytic reduction method to deposit coatings without external current, and there is no problem of uneven current density.
Mesa Structure can define the active region, and then control the current direction of the upper surface area of a conductive sheet, so that each element can operate independently without interfering with each other.
Glass Passivation Process, GPP is used to improve component Leakage capability, through Lithography Process and Glass Firing to achieve its purpose
